D-MAX DMC-20SEC Manuel d'utilisateur télécharger pdf (Page 10)

In consequence, this is the most important part of the AOI inspection process. Most scientific

papers are preoccupied with this subject [95]-[123]. The quality of the solder joint (and the

soldering process) can be inspected with the methods described in this section. The quality of

the solder joints is determined from geometric and optical properties of the solder meniscus.

These parameters determine the reflection properties of the meniscus which is formed from

the liquid alloy during the soldering process. After cooling, the meniscus becomes solid and

reflects illumination which means that we can evaluate it (Fig.5, Fig. 6). From these reflection

patterns and with the help of image processing algorithms we are able to determine the quality

of the solder joints.

Figure 4. Schematic of the meniscus

Figure 5. Reflection pattern on meniscus model with white ring illumination

Materials Science - Advanced Topics396

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D-MAX DMC-20SEC Manuel d'utilisateur Page 10