D-MAX DMC-20SEC Manuel d'utilisateur Page 12

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Manufacturer TRI Innovation
Model
TR7530 S3016 S3054QC
Field of view (orthogonal
camera) [pixel]
1024 x 768 2752 x 2048 @ 55 x 43 mm 672 x 512
Pixel size (orthogonal
camera) [µm]
10; 15; 20 22; 10 22; 10
Number of cameras
(orthogonal)
1 4 1, 2 or 4
Resolution (angled view
camera) [µm/pixel]
n.a. 15 n.a.
Number of cameras (angled
view)
n.a. 4 n.a.
Illumination
ultra-low angle, multi-
segment, RGB LED
lighting
n.a. n.a.
Inspection speed
72 sq. cm/sec @ 20 µm;
40 sq. cm/sec @ 10 µm;
18 sq. cm/sec @ 10 µm
typical connector with 100 pins
15 sec
typical connector with 100 pins
15 sec
Board size max. [mm]
400 x 300 430 x 406 443 x 406
Board size min. [mm]
50 x 50 n.a. n.a.
Board weight max. [kg]
3 n.a. n.a.
Conveyor height [mm]
n.a. 850 - 960 850 - 960
Board edge clearance [mm]
3 3 3
Board clearance top [mm]
25 50 15
Board clearance bottom
[mm]
40 35 50
Applicability
missing component,
tombstone, billboard,
polarity, skew, marking,
defective, insufficient and
excess solder, bridge,
trough hole pin, lifted
lead, golden finger,
scratch, blur
selective and special solder
joints
selective and special solder
joints
Viscom
Table 5. Comparison of Post Soldering Inspection (PSI) machines
Materials Science - Advanced Topics398
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